| 1. | Studies show that water vapor quickly permeates plastic packaging material .
研究证明水蒸汽能迅速渗入塑料封装材料。 |
| 2. | There are four translators in each package so a number of lines may be interfaced .
在每个封装壳中装有4个变换器，从而可以同许多线接口。 |
| 3. | After completely processed wafers are tested, those chips that pass the tests are ready to be packaged .
全部工艺完成后，片子要进行测试，合格的片子便去封装。 |
| 4. | Packaging is now receiving more attention by both packaged-device vendors and system builders .
现在封装越来越受到成品器件的销售人员以及系统的施工人员两方面的更多注意。 |
| 5. | Shorts between metal runners are important only in those regions of the chip with a high density of closely packed metal runners .
金属布线间的短接，仅在那些具有高密度密集封装型金属布线的芯片中才极为重要。 |
| 6. | At every step of production, from crystal growth to device packaging, numerous refinements are being made to improve the yield and reliability .
在生产中，为提高其成品率和可靠性，从晶体生长到器件封装每一步工序均有很多细致工作要做。 |
| 7. | Class encapsulates the information needed to bind to a list of
类封装绑定到一组 |
| 8. | Ultrathin wafer level chip size package technology
超薄型圆片级芯片尺寸封装技术 |
| 9. | Handle a file handle for the file that the current
对象将封装的文件的文件句柄。 |
| 10. | Investigation of electroless nickel gold bump technology
芯片封装技术的发展演变 |
