| 1. | Semiconductor packaging equipment communication using winsock
实现半导体封装设备的通信 |
| 2. | Wire bond parameter optimization in semiconductor assembly
半导体封装超声波压焊的工艺参数优化 |
| 3. | Capacity planning in semiconductor assembly and test manufacturing system
半导体封装测试系统的生产能力规划 |
| 4. | The study of wip control system in semiconductor assembly and test factory
半导体封装测试厂库存控制系统的研究 |
| 5. | Assembly process and product reliability assurance system in samsung suzhou semiconductor
苏州三星半导体封装工艺及产品可靠性保障体系 |
| 6. | Its main customers cover many famous semi - conductor assembly & test industrial componaies
其主要客户包括世界著名的半导体封装及测试公司。 |
| 7. | To provide consultation and training to engineers / technicians on materials science / technology , and semiconductor packaging technology
为工程师和技术员提供原材料技术和半导体封装技术支持和培训。 |
| 8. | Amkor technology ' s mission is to be the world ' s premier semiconductor assembly and test services company through customer satisfaction , leading edge technology and financial performance
安靠的使命是通过客户的满意度、先进的技术和财务表现成为世界领先的半导体封装测试企业。 |
| 9. | A kind of particle swarm optimization method with the characteristic of logical time - sequenced is proposed and applied to procedure parameters optimization of semiconductor assembly product line
摘要提出一种具有逻辑时序特征的微粒群优化算法，并将其应用于半导体封装生产线的工序参数优化中。 |
| 10. | It is suited for : high - tech electronic parts and related products such as magnetic head , ic , lsi , optical fiber , semiconductor , electronic lead frame and etc , require high precision disc wheel with high precision , efficiency cutting and break molding
适用：高科技电子零件及相关产品，如磁头ic lsi光纤半导体封装品电子导线架等，要求高精度高效率切割切断加工的高精密薄片砂轮。 |
