English translation for "封装设计"
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- packaging design
Related Translations:
封装继承: encapsulation inheritance 半导体封装: semiconductor assembly 激光封装: package sealing with laser 真空封装: evacuated packagevacuum encapsulation 玻璃封装: glass encapsulativeglass envelopeglass packageglass sealing 封装器: packetizertcp wrapperwrapper
- Example Sentences:
| 1. | Detailed information of the two standards is presented and the system is designed in accordance with the structure of java card
论文对两个标准体系给出详细介绍,并结合javacard体系结构进行封装设计。 | | 2. | 4 . a new level of electronic package design is developing to fulfill the requirement of high density electronic packaging technology
日沁；司知‘匕子封装己经对，匕于封装设计提出了更高的要求。 | | 3. | However , the die cracking was dependent on the young ' s modulus and cte of underfill materials . due to the higher cte and lower
山于薄型芯片在高密度封装使用中越来越广泛，本文的结果对高密度封装设计有重要意义。 | | 4. | Industrial automation systems and integration - product data representation and exchange - part 210 : application protocol : electronic assembly , interconnection and packaging design
工业自动化系统和集成.产品数据表示和交换.第210部分:应用协议:电子组件互连和封装设计 | | 5. | Therefore , it is necessary to establish and develop a set of convenient and efficient method to test and calculate thermal stresses and deformation in the study of package design and reliability analysis
因此，建立和发展一套简便有效的热应力和变形估算方法，是封装设计和可靠性研究中必不可少的工作。 | | 6. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南 | | 7. | In this thesis , the design concept and methodology , design standard , and the general program of measurement , simulation and automatically design are all described in detail based on electrical , thermal and mechanical design in electronic packaging for qualification of product , optimization of design , and minimization of time to market
上要方面，详细归纳总结了电于封装设计的的基本概念和一股方法，设计规范，测试，模拟和设计的一般流程。山此达到确保j ‘上品；兄质，优化设汁和缩短产品上市周期的目mb 。 | | 8. | In the second part , the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials , die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components . in the last chapter , the design tool for advanced electronic package was studied . the main conclusions in the second part are as follows
论文第二部分电子封装可靠性研究包含对塑封材料中水汽扩散研究、填充不流动胶的倒装焊芯片可靠性研究以及大功率器件散热问题研究三方面内容，最后为实现封装设计标准化和自动化，研究了若干最主要的电子封装构型的参数化有限元建模、加载和相应的求解方法。 |
- Similar Words：
- "封装类" English translation, "封装类型" English translation, "封装密度" English translation, "封装片" English translation, "封装器" English translation, "封装式postscript" English translation, "封装式程式" English translation, "封装式程序包" English translation, "封装式磁控管" English translation, "封装式电晶体" English translation
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