| 1. | The reworkable underfills technology for flip chip
倒装芯片的可修复底部填充技术 |
| 2. | Research on the thermode bonding procee for flip chip
倒装芯片热电极键合工艺研究 |
| 3. | Flip chip will be a new method of packaging technology
倒装芯片将成为封装技术的最新手段 |
| 4. | Bump fabrication methods for flip chip
倒装芯片凸点制作方法 |
| 5. | Screen printing technology for solder ball flip chip for smt
倒装芯片及晶圆和基底凸起的网版印刷技术一 |
| 6. | Current research on the reaction between solder bump and under bump metallurgy systems in flip chip
倒装芯片中凸点与凸点下金属层反应的研究现状 |
| 7. | Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。 |
| 8. | The assembly process and experimental results are included in this paper . in order to increase the power density of the module , a three - dimensional fc - ipem package structure is introduced . a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique
为实现更高的功率密度，本文把微电子行业中广泛应用的倒装芯片技术应用于模块电源研究中，完成了一个半桥fc - ipem ( flipchip - integratedpowerelectronicsmodule )模块。 |
