倒装芯片 meaning in Chinese
face down chip
flichip
flipped chip
Examples
- The reworkable underfills technology for flip chip
倒装芯片的可修复底部填充技术 - Research on the thermode bonding procee for flip chip
倒装芯片热电极键合工艺研究 - Flip chip will be a new method of packaging technology
倒装芯片将成为封装技术的最新手段 - Bump fabrication methods for flip chip
倒装芯片凸点制作方法 - Screen printing technology for solder ball flip chip for smt
倒装芯片及晶圆和基底凸起的网版印刷技术一