Flip chip technology has become one of the major joining technologies in electronic packaging 摘要覆晶技术已成为电子构装中之主要接合技术之一。
2.
The current crowding effect and temperature distributions in flip chip solders are discussed 本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
3.
It is found that the highest consumption rates of barrier layers in certain parts of flip - chip joints are related to the current crowding phenomena 结果发现在覆晶接点中，障层的消耗速率和电流聚集的位置有密切关联。
4.
It is also found that the geometry of a flip - chip joint and void formation have stronger effects upon current crowding than the multi - phase nature of solder bumps does 在本研究亦发现，覆晶接点的几何形状和孔洞对于电流聚集有很大的影响，其效应远胜于焊料中的多相结构。
