| 1. | Determining solderability of thick film conductors
厚膜导体的软钎焊性测定 |
| 2. | Standard test method for solderability of metallic - coated products
金属涂覆产品的软钎焊性试验方法 |
| 3. | Standard test method for solderability of metallic - coated products
金属覆盖层产品钎焊性的标准试验方法 |
| 4. | Solderability test method
软钎焊性试验方法 |
| 5. | Solderability and brazeability . definition and use of a specimen with variable gap
可钎焊性.带可变间隙试样的定义和使用方法 |
| 6. | Solderability tests for component leads , terminations , lugs , terminals , and wires
元件引线终端接线片端子和电线的可钎焊性试验 |
| 7. | Solderability tests for component leads , terminations , lugs , terminals and wires
元件引线接线端焊片接头和金属丝的软钎焊性试验 |
| 8. | Tp 52 test procedures for solderability of contact terminations use in connectors sockets
连接器插座中使用的触点终端的软钎焊性的tp52试验程序 |
| 9. | Environmental testing - tests - test ta - soldering - solderability testing by the wetting balance method
环境试验.试验.试验2 . 1ta :钎焊.用湿平衡法进行钎焊性试验 |
| 10. | Aerospace series - elements of electrical and optical connection - test methods - part 501 : soft solderability
航空航天系列.光电连接件.试验方法.第501部分:软钎焊性 |
