| 1. | Figure 7 shows the sequence for tape bonding the chip and assembling the package .
图7所示为带状引线连接芯片和管壳装配的工艺程序。 |
| 2. | These crystals are the basis of the semiconductor chips which run modern computers .
现代计算机里使用的半导体芯片都少不了这种结晶体。 |
| 3. | This yield model can be extended to chips containing more complex redundant circuitry .
这种成品率模型可以扩充到包含更复杂的备用电路系统的芯片。 |
| 4. | Exploded in space, it could fry the electronic circuitry and computer chips of an enemy command center .
它在空间爆炸，能够瓦解敌人指挥中心的电子线路和计算机芯片。 |
| 5. | Shorts between metal runners are important only in those regions of the chip with a high density of closely packed metal runners .
金属布线间的短接，仅在那些具有高密度密集封装型金属布线的芯片中才极为重要。 |
| 6. | Ultrathin wafer level chip size package technology
超薄型圆片级芯片尺寸封装技术 |
| 7. | Exploration on data usage of breast cancer gene chip
乳腺癌基因芯片数据使用探讨 |
| 8. | Adapter model or chipset , irq , and bus type
适配器型号或芯片集、 irq和总线类型 |
| 9. | Nami technology , real micro - computer controlling
纳米技术,全智能电脑芯片控制。 |
| 10. | Investigation of electroless nickel gold bump technology
芯片封装技术的发展演变 |
