| 1. | Structure ceramic materials used in electronic components
电子元器件结构陶瓷材料 |
| 2. | Silicon resins used as joining material for structural ceramics
用作结构陶瓷连接剂的有机硅树脂 |
| 3. | Test methods for properties of structure ceramic used in electronic components - test method for gas - tightness
电子元器件结构陶瓷材料性能测试方法气密性测试方法 |
| 4. | Test methods for properties of structure ceramic used in electronic components - determination of microstructure
电子元器件结构陶瓷材料性能测试方法显微结构的测定 |
| 5. | Test methods for properties of structure ceramic used in electronic components - test method for liquid permeability
电子元器件结构陶瓷材料性能测试方法透液性测定方法 |
| 6. | Test methods for properties of structure ceramic used in electronic components - test method for volume resistivity
电子元器件结构陶瓷材料性能测试方法体积电阻率测试方法 |
| 7. | Test methods for properties of structure ceramic used in electronic components - test method for chemical durability
电子元器件结构陶瓷材料性能测试方法化学稳定性测试方法 |
| 8. | Test methods for properties of structure ceramic used in electronic components - test method for mean coefficient of linear expansion
电子元器件结构陶瓷材料性能测试方法平均线膨胀系数测试方法 |
| 9. | Test methods for properties of structure ceramic used in electronic components - test method for dielectric loss angle tangent value
电子元器件结构陶瓷材料性能测试方法介质损耗角正切值的测试方法 |
| 10. | At the same time the problems existed in this research field and the future research directions were pointed out
本文详述了国内外离子注入结构陶瓷表面改性的研究现状，并对其改性机理进行了初步探讨。 |
