| 1. | Structure ceramic materials used in electronic components
电子元器件结构陶瓷材料 |
| 2. | Test methods for properties of structure ceramic used in electronic components - test method for gas - tightness
电子元器件结构陶瓷材料性能测试方法气密性测试方法 |
| 3. | Test methods for properties of structure ceramic used in electronic components - determination of microstructure
电子元器件结构陶瓷材料性能测试方法显微结构的测定 |
| 4. | Test methods for properties of structure ceramic used in electronic components - test method for liquid permeability
电子元器件结构陶瓷材料性能测试方法透液性测定方法 |
| 5. | Test methods for properties of structure ceramic used in electronic components - test method for volume resistivity
电子元器件结构陶瓷材料性能测试方法体积电阻率测试方法 |
| 6. | Test methods for properties of structure ceramic used in electronic components - test method for chemical durability
电子元器件结构陶瓷材料性能测试方法化学稳定性测试方法 |
| 7. | Test methods for properties of structure ceramic used in electronic components - test method for mean coefficient of linear expansion
电子元器件结构陶瓷材料性能测试方法平均线膨胀系数测试方法 |
| 8. | Test methods for properties of structure ceramic used in electronic components - test method for dielectric loss angle tangent value
电子元器件结构陶瓷材料性能测试方法介质损耗角正切值的测试方法 |
| 9. | Test methods for properties of structure ceramic used in electronic components - test method for young ' s elastic modulus and poisson ratio
电子元器件结构陶瓷材料性能测试方法杨氏弹性模量泊松比测试方法 |
