| 1. | Specification for base materials for rigid and multi - layer printed boards
刚性多层印制电路板基材规范 |
| 2. | Specification for base materials for rigid and multilayer printed boards
硬质多层印制电路板基底材料的规范 |
| 3. | Base materials for printed circuits - base materials for printed circuits - test methods
印制电路板基材.第1部分:试验方法 |
| 4. | Standard specification for accessories for gypsum wallboard and gypsum veneer base
石膏墙板和石膏层板基底用附件的标准规范 |
| 5. | Base materials for printed circuits ; part 1 : test methods iec 60249 - 1 : 1982 a4 : 1993 ; german version en 60249 - 1 : 1993 a4 : 1994
印制电路板基材.第1部分:试验方法 |
| 6. | Base material for printed circuits - specifications - flexible copper - clad polyimide film , general purpose grade
印制电路板基材.第2部分:规范.第13节:通用柔性覆铜聚酰亚胺膜 |
| 7. | Main materials of printed circuit board ( pcb ) substrate were macromolecule resins , which were typical viscoelatic materials
电路板基板材料主要以高分子树脂为主，是典型的黏弹性材料。 |
| 8. | Base materials for printed circuits - part 2 : specifications ; specification no . 13 : flexible copper - clad polyimide film , general purpose grade iec 60249 - 2 - 13 : 1987 a1 : 1993 ; german version en 60249 - 2 - 13 : 1994 a1 : 1994
印制电路板基材.第2部分:规范.第13号规范:软覆铜聚酰 |
| 9. | Sinusoidal profile and triangular profile are chosen as the bottom profile , and the undulated profile varies periodically . newtonian fluid and non - newtonian fluid are considered in each flow model
选取两种波形底板模型:一种为正弦板基面;另一种为三角板基面,其轮廓曲线分别为周期变化的正弦和三角形曲线。 |
| 10. | The frozen damage of slab - foundation of channel irrigation structures in the northeast of china is the most serious and includes the general characteristics of frozen damage of the channel irrigation structures
我国冻土分布面积极为广阔，虽然东北地区渠系水工建筑物的板基冻害最为严重，但也是其它地区的共性问题。 |
