| 1. | Carry out in line inspections for key process step
执行关键工艺步骤的在线检测。 |
| 2. | The fabrication process of the sensor is described
根据集成传感器的结构，制定了相应的制备工艺步骤。 |
| 3. | Contact pressure gauges with electrical alarm contacts are suitable for controlling or regulating process sequences
带有电警报接点的接点压力表用于控制和调节工艺步骤。 |
| 4. | The contacts open or close electrical circuits in relation to the position of the pointer on the pressure gauge
接点根据压力表上的指示位置打开或关闭电路。带有电警报接点的接点压力表用于控制和调节工艺步骤。 |
| 5. | Differential pressure measuring instruments with electric contacts are suitable for controlling and regulating process sequences by means of the given process pressure
有电接点的差动式压力测量仪表适用于根据给定生产压力，控制和调节工艺步骤。 |
| 6. | The fabricative technics is complex and difficult , every step can be done repeatedly after doing a lot of experiments , and the figuration of chip is nice
工艺步骤复杂且难度大，经过大量的重复实验，最后每步工艺均能实现重复，且芯片外形美观。 |
| 7. | Differential pressure measuring instruments with electric microswitches are suitable for controlling and regulating process sequences by means of the given process pressure
有电子微开关的差动式压力测量仪表适用于根据给定生产压力，控制和调节工艺步骤。 |
| 8. | Differential pressure gauges with electrical alarm contacts or electrical output are suitable for controlling or regulating process sequences with the aid of the process pressure
带有电警报接点或电子输出的差动式压力表能根据生产压力控制或调节工艺步骤。 |
| 9. | The device processing was introduced in detail , and the flow chart of processing was protracted . the device performance can be influenced by some specific processing steps , and the influence was carefully analyzed
详细介绍了制备器件的工艺流程并绘制工艺流程图，分析了其中一些具体工艺步骤对器件性能的影响。 |
| 10. | When the two layers of sio2 with different refractive index are finished , the designed mask pattern is printed on the film by photolithography . after that , icp is performed for dry etching , then , the waveguide structures are obtained . at present , the rudimental graph of edg has been obtained
两层不同折射率的sio _ 2薄膜制备好之后，经过光刻、等离子体刻蚀( icp )的工艺步骤之后，形成了波导结构，初步制作出了器件的图形。 |
