Chinese translation for "封装形式"

encapsulation mode/form/modality

Related Translations:

分立封装:  discrete package

封装继承:  encapsulation inheritance

半导体封装:  semiconductor assembly

封装程序:  packaged programs

激光封装:  package sealing with laser

塑胶封装:  package plastic

树脂封装:  resin package

封装设计:  packaging design

真空封装:  evacuated packagevacuum encapsulation

封装器:  packetizertcp wrapperwrapper

Example Sentences:

	1.	Packaged in bga and pga 封装形式：
	2.	Which command verifies encapsulation as well as layer 1 and layer 2 statistics on a router configured for frame relay 在帧中继的配置中，哪一条命令可以用来校验数据在第一层和第二层上的封装形式
	3.	Therefore , the traditional testing of packaging format has been not enough , and it moves up to the wafer level 因此，传统使用封装形式的测试已不敷需求，渐渐往上游回溯至晶圆层级，被晶圆形式所取代。
	4.	Work , good optical function , high dependable , low spoilage , good direction - sense , ware length evenness , good stability , used for every environment 附加损耗低方向性好波长平坦性好环境稳定性好，适用于各种恶劣环境多种封装形式可选
	5.	This thesis overall views the historical development , future trend , active devices . sensitivity definitions and configurations of microwave and millimeter mixers , and then discuss several kinds of mixers and mixer diodes 本文系统地介绍了微波毫米波混频器的发展概况和今后的发展趋势、实现混频器的有源器件及其封装形式以及利用它们实现混频的优缺点。
	6.	As an advanced package , 3 - d stacked csp assembly provides significant size and performance advantages than traditional single chip package . meanwhile , high packaging density tends to generate more power in a package and cause serious thermal problem 三维叠层芯片尺寸封装( stackedchipscalepackage )是目前最先进的微电子封装形式之一,具有体积小、重量轻、封装效率高等特点。
	7.	The transistor count is 3 . 8 million ; the package is surface mount 240 - pin quad flat pack ( qfp240 ) ; and the die size is 98mm2 ; the most advanced research progress on microprocessor architecture is extensively studied to get technical preparations for microprocessor design 该处理器目前正在进行后端设计，即将采用0 . 25 mcmos工艺流片，整个处理器的晶体管数目为380万，封装形式是qfp240 ， die面积为98mm ~ 2 。
	8.	Recently , designers developed a new type of package : ball grid array ( bga ) package . the bga package has many i / o pins . because of this merit , this kind of package is used widely now . but the package has a new structrue , and the old routing algorithms are not used 鉴于球栅阵列封装( bga )的优点,这种技术成为目前最广泛的封装形式。然而由于球栅阵列封装( bga )结构的特殊性,对于这种封装上的布线算法不同于普通的布线算法。
	9.	The main results are as follows : 1 ) firstly , this paper furtherly analyzes and research on the high - voltage isolation optocouplers , the forms of the package , the aging rule , the character of isolation - voltage , the basic parameters and the typical applications of optocouplers in detail 主要内容为: 1 、首先对光电耦合器的结构特点、封装形式、老化规律、隔离电压特性、基本参数及典型应用等作了详细的分析和总结,为进一步的研究打下了深厚的理论基础。

Similar Words：

"封装土样" Chinese translation, "封装外壳" Chinese translation, "封装外形" Chinese translation, "封装向下转型" Chinese translation, "封装消毒" Chinese translation, "封装性" Chinese translation, "封装性要求" Chinese translation, "封装延迟" Chinese translation, "封装也叫有机管脚阵列" Chinese translation, "封装因子" Chinese translation