| 1. | Studies show that water vapor quickly permeates plastic packaging material .
研究证明水蒸汽能迅速渗入塑料封装材料。 |
| 2. | Xpxl , xpx , xpcl , xpc series
塑料封装- scx系列 |
| 3. | Recent advances in the study of moisture absorption in plastic electronic packaging
吸收湿气对微电子塑料封装影响的研究进展 |
| 4. | Analytical solutions of thermal stress distribution in plastic encapsulated integrated circuit packages
塑料封装集成电路结构热应力分布的解析解 |
| 5. | Semiconductor devices - mechanical and climatic test methods - part 32 : flammability of plastic - encapsulated devices externally induced
半导体器件.机械和气候试验方法.第32部分:塑料封装器件的易燃性 |
| 6. | Semiconductor devices - mechanical and climatic test methods - part 20 : resistance of plastic - encapsulated smds to the combined effect of moisture and soldering heat
半导体器件.机械和气候试验方法.第20部分:塑料封装的smds抗湿气和焊接热的综合影响 |
| 7. | Semiconductor devices - mechanical and climatic test methods - part 31 : flammability of plastic encapsulated devices internally induced iec 60749 - 31 : 2002 corr . 1 : 2003 ; german version en 60749 - 31 : 2003
半导体器件.机械和气候试验方法.第31部分:塑料封装器 |
| 8. | Semiconductor devices - mechanical and climatic test methods - part 32 : flammability of plastic - encapsulated devices externally induced iec 60749 - 32 : 2003 corr . 1 : 2003 ; german version en 60749 - 32 : 2003 corr . : 2003
半导体器件.机械和气候试验方法.第32部分:塑料封装器 |
