Determining effective adhesion of photoresist to hard - surface photomask blanks and semiconductor wafers during etching 测定在蚀刻期间光致抗蚀剂同硬表面光掩膜坯及半导体片的有效粘附性
2.
Testing of materials for semiconductor technology - determination of the geometric dimensions of semiconductor wafers - part 1 : thickness and thickness variation 半导体工艺材料试验.半导体片几何尺寸测量.第1部分
3.
Testing of materials for semiconductor technology - determination of the geometric dimensions of semiconductor wafers - part 5 : terms of shape and flatness deviation 半导体技术试验.半导体片几何尺寸测定.第5部分:形状
