| 1. | Interconnect wire delay questions in deep submicron ic design
深亚微米集成电路设计中的互连线延迟问题 |
| 2. | Shielding area optimization under the solution of interconnect crosstalk
减小互连线串扰的屏蔽线面积优化 |
| 3. | Image method used for coplanar interconnects dependent parameter calculation
用镜像电荷法求取共面互连线寄生参数 |
| 4. | Geometrical optimizing design of interconnection for deep sub - micrometer vlsi circuits
电路中互连线的几何优化设计 |
| 5. | The snam results of local stress distribution are in close agreement with the results of computer simulation
利用计算机模拟了温度场变化引起的铜互连线中热应力分布。 |
| 6. | The mechanical simulation compared the stress distribution in copper lines and pore , with the result that the maximum stress locates in the corner
在力学模拟过程中，计算了铜互连线和通孔的热应力的分布。 |
| 7. | Studies on the stress of copper interconnects include the stress measurement by xrd , computer simulation and observation the local stress distribution with snam
利用薄膜应力测试分布仪和xrd测量硅基铜膜及铜互连线薄膜宏观应力。 |
| 8. | On the other hand , tddb experiments of copper interconnection have been taken to prove the performance improvement of interconnect by the use of low - k dielectric
试验方面则进行了铜互连线的tddb试验，来验证低k介质对互连性能的改善。 |
| 9. | Consequently , the metal interconnects of vlsi have smaller sectional area and carry increasing power density , which made the electromigration become one of the main latent damage modes
作为vlsi互连线的金属薄膜的截面积越来越小，其承受的功率密度急剧增加，使得电迁移成为电路的主要失效模式之一。 |
