For prolonged atmospheric sinter firing and infiltration firing of vita in - ceram frameworks created using the slip technique 用于由堆涂技术制成的vita全瓷支架的长时间非真空烧结和渗透培烧。
2.
As a king of cementing material with high property , hpmc is used for paint , paper making , tobacco products and ceram products Hpmc作为一种高性能粘结剂，运用于颜料、造纸、烟草产品和陶瓷产品。
3.
Hpmc is a kind of water preserving agent with high efficiency . it is widely used in ceram , building material and many other aspects Hpmc是一种高效保水剂。在陶瓷、建筑材料以及许多其它方面具有广泛的应用。
4.
A fully automatic , microprocessor - controlled furnace specially designed for the fabrication of highly stable all - ceramic frameworks using the vita in - ceram slip technique 全自动，电脑控制烤瓷炉，专为高度坚固的运用vita全瓷堆涂技术的全瓷支架而设计。
5.
The injection molding process for metal or ceram powder is a new style manufacture technology which combines plastic molding process with powder metallurgy process and powder pottery molding 金属粉末注射成形技术是一种将粉末冶金工艺与塑料成形工艺相结合的新型制造技术。
6.
P . durh , m . villegas , f . capel , p . recio & c . moure , “ low - temperature sintering and microstructural development of nanocrystalline y - tzp powders ” , j . eur . ceram . soc . , 16 , 945 ( 1996 ) 澎信文，添加微量氧化铝对于氧化锆陶瓷材料制备与烧结行为之研究，材料年会论文集， ( 2005 ) 。
7.
Upholding the enterprise spirit of upmost , the clients ; foremost , the quality , lihua industrial ceram ics plan of fenghua sincerely welcomes the clients from home and abroad to make common development in joint efforts 奉化市利华工业陶瓷有限公司以“客户至上，质量第一”为企业精神，竭诚欢迎国内外客商携手合作，共同发展。
8.
Square resistance of bapb _ ( 1 - x ) bi _ xo _ 3 based thick films was near - linear increased and tcr of bapb _ ( 1 - x ) bi _ xo _ 3 based thick films was near - linear decreased with increase of content of ag . the electric conduction model of bapb _ ( 1 - x ) bi _ xo _ 3 based thick films was formed . bapb _ ( 1 - x ) bi _ xo _ 3 based thick film is actually conductive with lead and bismuth oxide , the main factors on the properties of thick film is the electric resistance and contact resistance of conductive particulates ; the electric conduction model of ag - bapb _ ( 1 - x ) bi _ xo _ 3 based thick film : the general structure of conductive network is constructed by conductance chain of ag and is submerged into bapb _ ( 1 - x ) bi _ xo _ 3 based conductive ceram 本文认为: bapb _ ( 1 - x ) bi _ xo _ 3厚膜电阻是一种掺有铅、铋氧化物的导电陶瓷烧结体,影响厚膜电阻导电性能的主要因素是导电颗粒自身电阻与颗粒间接触电阻;厚膜电阻掺银后的导电微观结构是由许多微小串联或并联的ag颗粒组成的导电链构成的结构复杂的多维导电网络,此导电网络被“淹没”在bapb _ ( 1 - x ) bi _ xo _ 3导电烧结体中。
