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覆晶技术 meaning in Chinese

flichip

Examples

  1. Flip chip technology has become one of the major joining technologies in electronic packaging
    摘要覆晶技术已成为电子构装中之主要接合技术之一。

Related Words

  1. 覆甲板
  2. 掩覆
  3. 覆审
  4. 黏土覆
  5. 防覆
  6. 覆面漆
  7. 包覆物
  8. 反覆切割
  9. 覆镍钢板
  10. 后覆尾羽
  11. 覆金属的
  12. 覆晶
  13. 覆晶接合
  14. 覆晶式封装
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