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覆晶技术
meaning in Chinese
flichip
Examples
Flip chip technology has become one of the major joining technologies in electronic packaging
摘要
覆晶技术
已成为电子构装中之主要接合技术之一。
Related Words
覆甲板
掩覆
覆审
黏土覆
防覆
覆面漆
包覆物
反覆切割
覆镍钢板
后覆尾羽
覆金属的
覆晶
覆晶接合
覆晶式封装
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