覆晶 meaning in Chinese
flichip
Examples
- Flip chip technology has become one of the major joining technologies in electronic packaging
摘要覆晶技术已成为电子构装中之主要接合技术之一。 - The current crowding effect and temperature distributions in flip chip solders are discussed
本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。 - It is found that the highest consumption rates of barrier layers in certain parts of flip - chip joints are related to the current crowding phenomena
结果发现在覆晶接点中，障层的消耗速率和电流聚集的位置有密切关联。 - It is also found that the geometry of a flip - chip joint and void formation have stronger effects upon current crowding than the multi - phase nature of solder bumps does
在本研究亦发现，覆晶接点的几何形状和孔洞对于电流聚集有很大的影响，其效应远胜于焊料中的多相结构。