电子封装 meaning in Chinese

electronic packaging

Current status of research on electronic packaging materials
电子封装材料的研究现状
Microstructures and properties of si - al alloy for
喷射沉积硅铝电子封装材料的组织与性能
The challenge of changeover to lead - free in electronic packaging
电子封装面临无铅化的挑战
Application and development of cad in electronic packaging
技术在电子封装中的应用及其发展
New progress of electronic packaging technology
电子封装技术的新进展

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