封装设计 meaning in Chinese
packaging design
Examples
- Detailed information of the two standards is presented and the system is designed in accordance with the structure of java card
论文对两个标准体系给出详细介绍,并结合javacard体系结构进行封装设计。 - 4 . a new level of electronic package design is developing to fulfill the requirement of high density electronic packaging technology
日沁；司知‘匕子封装己经对，匕于封装设计提出了更高的要求。 - However , the die cracking was dependent on the young ' s modulus and cte of underfill materials . due to the higher cte and lower
山于薄型芯片在高密度封装使用中越来越广泛，本文的结果对高密度封装设计有重要意义。 - Industrial automation systems and integration - product data representation and exchange - part 210 : application protocol : electronic assembly , interconnection and packaging design
工业自动化系统和集成.产品数据表示和交换.第210部分:应用协议:电子组件互连和封装设计 - Therefore , it is necessary to establish and develop a set of convenient and efficient method to test and calculate thermal stresses and deformation in the study of package design and reliability analysis
因此，建立和发展一套简便有效的热应力和变形估算方法，是封装设计和可靠性研究中必不可少的工作。