球栅阵列封装 meaning in Chinese

bga ball grid array package

Recently , designers developed a new type of package : ball grid array ( bga ) package . the bga package has many i / o pins . because of this merit , this kind of package is used widely now . but the package has a new structrue , and the old routing algorithms are not used
鉴于球栅阵列封装( bga )的优点,这种技术成为目前最广泛的封装形式。然而由于球栅阵列封装( bga )结构的特殊性,对于这种封装上的布线算法不同于普通的布线算法。