封装技术 meaning in Chinese
lga (land grid arry)
packaging technique
Examples
- Ultrathin wafer level chip size package technology
超薄型圆片级芯片尺寸封装技术 - Investigation of electroless nickel gold bump technology
芯片封装技术的发展演变 - Progress and application for mems packaging technologies
封装技术的发展及应用 - Csp causes the revolution of memory chip package technology
引发内存封装技术的革命 - Wlcsp wafer - level chip scale packaging technology
晶圆片级芯片规模封装技术