封装外形 meaning in Chinese
package outline
Examples
- Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则 - Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 1
半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统.修改件1 - Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则. p - vson的尺寸 - Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson
半导体器件的机械标准化.第6部分:表面安装半导体器件封装外形图绘制的一般规则. p - vson的尺寸 - Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; dimensions of p - vson
半导体器件的机械标准化.第6 - 10部分:表面安装半导体器件封装外形图绘制的一般规则. p - vson的尺寸