圆片级封装 meaning in Chinese
wlwafer level package
Examples
- Novel alignment technologies for wafer level packaging
圆片级封装的新颖对准技术 - Wafer - level packaging technology and application
圆片级封装技术及其应用 - A novel package for microelectronics : wafer level package
圆片级封装 - Lead - free solder bumping technology for wafer level package
圆片级封装的无铅焊料凸点制作技术研究 - The development of wafer - level packaging
圆片级封装技术展望