倒装焊 meaning in Chinese
fcb flichibonding
Examples
- Flip chip bonding technology used in modern micro - photoelectron package
现代微光电子封装中的倒装焊技术 - The report of determination for interface delamination propagation rate of real flip chip packages is hardly found up to now
目前，测定实际倒装焊封装界面分层传播速率报道尚少见。 - The reliability of flip chip package was studied in this work by both experimental measurements and finite element simulations
本文针对倒装焊封装可靠性问题进行了实验和数值模拟两方面的研究。 - To our knowledge , for real flip chip packaging under the thermal loading , the paris equation obtained from experiment da / dn and simulation g is firstly reported here , and will be useful practically
本文在热循环加载条件下对实际倒装焊封装给出实验da / dn和模拟g关系的paris方程，属首次报导。 - Then , the half - empirical paris equation , which can be used as a design base of flip chip package reliability , have been determined from the crack propagation rates da / dn measured and the energy release rates g simulated
然后由实验测得界面裂缝扩展速率和有限元模拟给出的能量释放率，拟合得到可作为倒装焊封装可靠性设计依据的paris半经验方程。