| 1. | System of quality assessment - sectional specification - rigid double - sided printed boards with plated - through holes
质量评估体系.分规范.有镀通孔的刚性双面印制板 |
| 2. | Interstitial via hole : an embedded through - hole with connection of two or more conductor layers in a multilayer pcb
埋孔：多层pcb内的连接两个或以上导体层的镀通孔。 |
| 3. | Reliability of plated through hole ( pth ) has close relationship with technology parameters during manufacture process
摘要镀通孔的可靠性与制造过程工艺参数有非常密切的关系。 |
| 4. | Is plated copper being test in the environmental test chamber ? if so , what is the test frequency
对于镀通孔，测试是否在（可设定条件的）环境舱内进行？如果是，测试频率是多少？ |
| 5. | System of quality assessment - capability detail specification - rigid double - sided printed boards with plated - through holes
质量评估体系.性能详细规范.带镀通孔的刚性双面印制板 |
| 6. | Capability detail specification : single and double sided printed boards with plated - through holes ; german version en 123200 - 800 : 1992
性能详细规范.带电镀通孔的单面和双面印制电路板 |
| 7. | Harmonized system of quality assessment for electronic components : sectional specification : single and double sided printed boards with plated through holes
电子元器件质量评定统一体系.分规范:具有镀通孔的单面和双面印制电路板 |
| 8. | Current research of failure mechanism and physics model of pth in manufacture process including drilling , electroless plating and electroplate were reviewed
从钻孔、化学镀铜、电镀三个主要工艺入手，对目前制造过程镀通孔失效的机理与物理模型的研究现状进行总结。 |
