| 1. | What difference ( s ) should i expect to see
使用无铅锡膏主要会有什么不同？ |
| 2. | Optimizing of parameters about stencil printing
印刷锡膏工艺参数的优化 |
| 3. | 6 is the sequence of solder paste height measurements defined
锡膏厚度的测量顺序是否指定 |
| 4. | What is efd suggesting for a lead - free alternative to 63 / 37
Efd建议用哪种类型的无铅锡膏代替63 / 37锡膏？ |
| 5. | Q : what is efd suggesting for a lead - free alternative to 63 / 37
Efd建议用哪种类型的无铅锡膏代替63 / 37锡膏？ |
| 6. | The operator should use the solder paste quickly after it has been taken out
取出的锡膏要尽快实施印刷使用。 |
| 7. | The most obvious is the necessity for increased reflow temperature
最明显的是，使用无铅锡膏必须提高回流焊温度。 |
| 8. | 7 is the average and range of solder paste height measurements spc controlled
锡膏厚度测量的平均值和间距spc是否受控 |
| 9. | So it will result in rigidity skin & block and solder balls etc
产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。 |
| 10. | You should not have to change your stencil design to accommodate the change to lead - free
您不需要为更换无铅锡膏而更改钢板设计。 |
