| 1. | M . i . c . c . mineral - insulated copper - covere 矿物绝缘铜护套矿物绝缘铜包的 |
| 2. | Specifications - specification for flexible copper - clad polyester film 规范.挠性铜包层聚酯薄膜规范 |
| 3. | Copper - clad aluminium conductor 铜包铝导体 |
| 4. | Copper - clad aluminium wire 铜包铝线 |
| 5. | Base materials for printed circuits - part 2 : specifications - specification n o 1 : phenolic cellulose paper copper - clad laminated sheet high electrical quality 印刷电路用基材.第2部分:规范. 1号规范.高电气性能的铜包覆片层状酚醛纤维素纸 |
| 6. | Are non - inductively with wound polyester film as the dielectric and aluminum foil as the electrode with copper - clad steel leads and epoxy resin coating 为有感结构,用聚酯薄膜作为电介质和铝箔为电极绕制而成,导线采用镀锡铜包铜线,使用环氧树脂包封。 |
| 7. | Are non - inductively wound with polypropylene film as the dielectric and aluminum foil as the electrode with copper - clad steel leads and epoxy resin coated 为无感结构,用金属化聚丙烯膜作为电介质和铝箔为电极卷绕而成,导线采用镀锡铜包铜线,使用环氧树脂包封。 |
| 8. | Are non - inductively wound with metallized polypropylene film as the dielectric and aluminum foil as the electrode with copper - clad steel leads and epoxy resin coating 为无感结构,用聚丙烯薄膜作为电介质和铝箔为电极绕制而成,导线采用镀锡铜包铜线,使用环氧树脂包封。 |
| 9. | Are non - inductively wound with metallized polyester film as dielectric / electrode with copper - clad steel leads and encapsulated in a plastec case sealed with epoxy resin 为无感结构,用金属化聚酯薄膜作为电介质/电极绕制而成,导线采用镀锡铜包铜线,使用环氧树脂密封在塑料壳内。 |
| 10. | Are non - inductively wound with metallized polyester film as the dielectric / electrode with copper - clad steel leads and encapsulated in a plastic case sealed with expoxy resin 为无感结构,用金属化聚酯膜作电介质/电极绕制而成,导线采用镀锡铜包铜线,使用环氧树脂密封在塑料壳内。 |