| 1. | All electronics assemblies using lead in solder
使用含铅焊料的所有电子配件。 |
| 2. | Study on the reliability of sn - ag - cu lead - free solders
无铅焊料的可靠性研究 |
| 3. | Development and research of self - adaptive lead - free solders
自适应无铅焊料的开发与研究 |
| 4. | Lead - free solder bumping technology for wafer level package
圆片级封装的无铅焊料凸点制作技术研究 |
| 5. | Current status and trends in research of lead - free solders in electronics
电子产品用无铅焊料的研究现状和趋势 |
| 6. | Methods for chemical analysis of tin - lead solders - determination of tin content
锡铅焊料化学分析方法锡量的测定 |
| 7. | Methods for chemical analysis of tin - lead solders - determination of iron content
锡铅焊料化学分析方法铁量的测定 |
| 8. | Methods for chemical analysis of tin - lead solders - determination of zinc content
锡铅焊料化学分析方法锌量的测定 |
| 9. | Methods for chemical analysis of tin - lead solder - determination of bismuth content
锡铅焊料化学分析方法铋量的测定 |
| 10. | Methods for chemical analysis of tin - lead solders - determination of silver content
锡铅焊料化学分析方法银量的测定 |
