| 1. | Sectional specification : single and double sided printed boards with plain holes
无金属化孔单双面印制板分规范 |
| 2. | Sectional specification : single and double sided printed boards with plated - through holes
有金属化孔单双面印制板分规范 |
| 3. | Capability detail specification : single and double sided printed boards with plain holes
无金属化孔单双面印制板能力详细规范 |
| 4. | Grading standard of quality for single and double sided printed boards with plain holes
无金属化孔单双面印制板的质量分等标准 |
| 5. | Capability detail specification : single and double sided printed boards with plated - through holes
有金属化孔单双面印制板能力详细规范 |
| 6. | Specification for single and double sided carbon - coated printed boards without interlayer connection
无金属化孔单双面碳膜印制板规范 |
| 7. | Micro - resistance test method of plating thickness of plated through holes for printed boards
印制板金属化孔镀层厚度测定方法微电阻法 |
| 8. | Grading standard of quality for single and double sided printed boards with plated - through holes
有金属化孔的单双面印制板的质量分等标准 |
| 9. | Printed boards . part 5 : specification for single and double sided printed boards with plated - through holes
印制板.第5部分:具有金属化孔的单面和双面印制板规范 |
| 10. | It is obvious that , in general , guard rings should be on both sides of the pcb with plated - through holes
显然，一般情况下，在pcb的上下表面都应设计保护环，二者通过金属化孔相连。 |
