| 1. | Mica tapes - polyimide film - backed mica paper tapes
云母带.聚酰亚胺薄膜粉云母带 |
| 2. | Current status of research on polyimide membrane mirror
聚酰亚胺薄膜反射镜的研究现状 |
| 3. | Adhesive coated polyimide film for flexible printed circuits
挠性印制电路用涂胶聚酰亚胺薄膜 |
| 4. | Evaluation of polyimide film developing level in china
我国聚酰亚胺薄膜制造技术发展水平的评估 |
| 5. | The effect on thermal stability of polyimide films based on phthalimide end - capped odpa and oda
聚酰亚胺薄膜热稳定性的影响 |
| 6. | The dopping effect of nano - inorganic on structure and dielectric properties of polyimide films
无机纳米掺杂对聚酰亚胺薄膜的结构和介电性能影响 |
| 7. | Measuring the relative dielectric constant of dupont 100hn and 100cr polyimide film under optical frequency
两种聚酰亚胺薄膜光频相对介电常数的测定 |
| 8. | Thermal expand coefficient of polyimide films at each temperature was measured in the process of thermal cycling
摘要测量了聚酰亚胺薄膜在冷热循环过程中各温度点的热膨胀系数。 |
| 9. | Base materials or printed circuits . part 2 : specifications . speciication no 13 : flexible copper - clad polyimide film , general purpose grade
印刷电路用基材.第2部分:规范. 13号规范:一般用途级包铜软聚酰亚胺薄膜 |
| 10. | Base materials for printed circuits . part 2 : specifications . specification no 15 : flexible copper - clad polymide film , of defined flammability
印刷电路用基材.第2部分:规范. 15号规范:规定易燃性的包铜软聚酰亚胺薄膜 |
