| 1. | Figure 2 illustrates the fundamental aspects of a die bond .
图2所示为管芯连接的基本结构。 |
| 2. | Figure i.1 shows a basic laser diode chip which consists of two cleaved parallel facets and two sawed (roughened) sides .
图.1所示的是由两个平行解理面和二个锯出的（粗糙）侧面组成的激光二极管的管芯。 |
| 3. | To avoid the exposure of the die and its wire or tape bonds to viscous molding material, the premolded package concept was developed .
为了避免管芯裸露出以及引线或带状引线与粘滞的模压材料相粘合，才提出前模压管壳的概念。 |
| 4. | Core type prestressed concrete pipe for water
预应力混凝土输水管管芯缠丝工艺 |
| 5. | Aluminium tubes used for wickless gravity heat pipes
无管芯重力热管铝管材 |
| 6. | Core type prestressed concrete pipe
预应力混凝土输水管管芯缠丝工艺 |
| 7. | Rings of dies of semiconductor devices
电力半导体器件用管芯定位环 |
| 8. | Wickless aluminium gravity heat pipes
铝无管芯重力热管 |
| 9. | Chemically polished chip
化学抛光管芯 |
| 10. | Insert the stylet into the endotracheal tube , maintaining the tube ' s natural curve
把导管管芯插入气管导管，保持导管正常的曲度。 |
