Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array 半导体器件的机械标准化.第6 - 5部分:表面安装半导体器件外壳外形图绘制的一般规则.小螺距刃片栅格排列的设计指南
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Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine pitch land grid array 半导体器件的机械标准化.第6 - 6部分:平面式安装半导体器件外壳外形图绘制的一般规则.小螺距刃片栅格排列的设计指南
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Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array 半导体器件的机械标准化.第6 - 6部分:半导体器件包装用表面安装略图制备的一般规则.小螺距刃片栅格排列的设计指南
