English translation for "灌封材料"

embedding material
encapsulating material
material, encapsulating

Related Translations:

轻灌:  light irrigation

水泥灌:  cement grouting

灌药瓶:  drenching bottlemedicine administering bottle

灌草丛:  shrub-meadow

垄灌:  ridge irrigation

深孔灌:  deep grouting

割灌刀:  [林学] bush knife; machete

热灌法:  hot penetration method

油灌接缝:  tank joint

灌篮少年:  dear boys

Example Sentences:

	1.	Development of organic silicon encapsulation 有机硅灌封材料的研究进展
	2.	Encapsulation materials of expoy series for use in electronic components 电子元器件用环氧系灌封材料
	3.	Morphology and mechanical properties of mg pu ep encapsulating composite 环氧灌封材料的形态结构与力学性能
	4.	Based on the over research , three different kinds of encapsulating materials of epoxy resin are performed 在各种不同制备方法研究的基础上，选用不同的改性体系制备出环氧灌封材料，并对其性能作了评价。
	5.	Test method for shrinkage stresses in plastic embedment materials using a photoelastic technique for electronic and similar applications 用光弹性技术测定电子及类似用途的塑料灌封材料的收缩应力的试验方法
	6.	Low viscosity , easily pourable potting material , with the ability to develop good adhesion to most substrates without the use of a primer , has a long working time and high temperature resistance , cure at elevated temperature 低粘度，易浇注的灌封材料，并在不需要底涂的情况下能获得较好的粘接性，操作时间长，耐高温，需加热固化。
	7.	Encapsulating materials of epoxy resin are modified with hgh , nano - sio2 and organophilic montmorillonite , in the present investigation , the microstructue , some properties and influence factors about nano - sio2 and organophilic montmorillonite modified encapsulatig materials have been systematically studied using x - ray diffraction , electron microscopy and differential thermal analysis measurement techniques 随着航空、电子等事业的发展，灌封器件的高性能化对灌封材料提出了越来越高的要求。探索制备环氧灌封材料的新方法，寻求提高其使用性能的有效途径是该领域研究的重要课题。
	8.	This paper mainly described the research on rheological property , high thermal stability , flame retardant , the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials , which greatly apply on electronic equipment and large scale integrated circuit and so forth 摘要本文主要综述了国内外用于电子元器件、大规模集成电路等高科技领域的有机硅灌封材料在流动、耐高温、阻燃和绝缘导热等方面的性能以及催化剂对灌封材料的影响的研究应用进展。
	9.	Test results show that that the breakcown voltage and heat distortion temperature the encapsulating materials of epoxy resin with hgh are famously improved , but the the addition of hgh , the viscosities of the epoxy resin - hgh system is higher compared with that of the others and the encapsulating process is effected . nano - sio2 improves the mechanical properties of encapsulating materials of epoxy resin , impact strength reaches 27 . 64kj / m2 from 13 . 95 kj / m2 , flexural strength reaches 136 . 68mpa from64 . 95 mpa . by addition of the montmorillonite , glass transition temperature and heat distortion temperature of the encapsulating materials are 13 . 2 and 16 higher than that of epoxy re 结果表明，活性硅微粉对环氧灌封材料的热变形温度和电学性能提高较为显著，尤其在浸水后，电学性能降低幅度很小，西北工业大学硕士学位论文但活性硅微粉用量较大，材料的工艺性能明显降低;纳米5102对环氧灌封材料具有显著的增强和增韧作用，冲击强度、弯曲强度由原来的13 . 95kj / mz和64 . 95mpa分别提高到27 . 64kjzm2和136 . 68mpa 。

Similar Words：

"灌东" English translation, "灌东阳" English translation, "灌豆碱" English translation, "灌而复抽的地下水" English translation, "灌封" English translation, "灌封的" English translation, "灌封机" English translation, "灌封胶" English translation, "灌封料" English translation, "灌封模套" English translation