| 1. | Cpk study of bonding process in hic production 混合集成电路键合工序能力指数探索 |
| 2. | Porcelain enameled steel substrate for hybrid integrated circuits 混合集成电路用被釉钢基片 |
| 3. | A study on bonding strength of hybrid integrated circuits 功率混合集成电路键合强度控制研究 |
| 4. | Copper conductor paste for thick film hybrid integrated circuits 厚膜混合集成电路用铜导体浆料 |
| 5. | Hic hybrid integrated circuit igniter unit 混合集成电路点火装置 |
| 6. | The measuring methods of dc dc converters for hybrid integrated circuits 混合集成电路dc dc变换器测试方法 |
| 7. | Compatible hybrid integrated circuit 相容混合集成电路 |
| 8. | Thin film hybrid integrated circuit 薄膜混合集成电路 |
| 9. | Microwave hybrid integrated circuit 微波混合集成电路 |
| 10. | Case outlines for film integrated circuits and hybrid integrated circuits 膜集成电路和混合集成电路外形尺寸 |