| 1. | Study on superplastic diffusion bonding of different steels
异种钢材的超塑性扩散连接工艺研究 |
| 2. | Present situation and developments of diffusion bonding titanium alloy and nonmetals
钛合金与非金属材料扩散连接研究现状与发展 |
| 3. | Current characteristics and frature analysis in field - assisted bonding of k4 glass - silicon
玻璃与硅片场致扩散连接过程中的电流特性与断口分析 |
| 4. | Progress of the research in the area of numerical simulation of transient liquid phase diffusion bonding
瞬间液相扩散连接过程数值模拟的研究进展 |
| 5. | The bonding technique of ceramics to metals is one of the central issues in materials engineering , and diffusion bonding is considered to be the most suitable method for bonding ceramics to metals
陶瓷与金属的连接技术是材料工程领域的热点研究课题，而扩散连接方法被认为是陶瓷与金属连接最适宜的方法。 |
| 6. | In this study , advanced laser surface treatment , superplastic , solid - joint technologies were used to the bond of a - tial alloy to realize the high quality bond of this alloy at low temperature and short time
本文将先进的激光表面处理，超塑成形，扩散连接工艺结合在一起，实现- tial合金低温、短时、高质量的固态连接。 |
| 7. | The research status quo of diffusion bonding of ceramics to metals is reviewed in this paper , and the emphases are placed on the interface reaction , stress analysis and bonding technology
本文综述了陶瓷与金属扩散连接的研究现状，重点介绍了界面反应研究、残余应力分析和连接工艺研究等内容，并在此基础上指出了研究中所存在的问题。 |
| 8. | Abstract : the feasibility and appropriate processing parameters for diffusion bo nding of titanium alloy to stainless steel web were investigated , the main facto rs affecting diffusion bonding and the microstructure of joints were analyzed
文摘:探讨了钛合金/不锈钢网扩散连接的可行性，确定了直接扩散连接条件下的最佳工艺参数，分析了影响扩散连接的主要因素及接头微观形态。 |
| 9. | The third model was designed to investigate atom diffusion at contacting point . fe was sintered at 500 , 550 > 600 , 650 > 700 under bpec and radiation heating . the test results of image processing indicated that the average pore size took on wavelike with temperature under bpec heating
脉冲大电流加热条件下，其它条件相同时，分别在800 、 900的温度武汉理土大学硕士学位论文下扩散连接cu丝和ni丝，结果表明接触线处cu和ni的扩散系数随温度的升高而增大。 |
| 10. | The fracture energy of cu / - aiodiffusion - welded joints was greatly increased by the introduction of the thin film nb interlayer whereas diffusion welding can be performed at a relatively low temperature ( 900 ) . the increase in fracture energy of the joints with nb film interlayer was attributed to the strong abhesion of nb to - aio combined with larger plastic deformation in the metal side during fracture tem observations showed large amounts of dislocations existing at the interfacial regions
本文主要内容就是概括地介绍了国内外关于扩散连接接头行为数值模拟的发展现状；主要包括界面孔洞消失过程、接头元素扩散与反应层的形成、接头变形与应力行为的数值模拟，以使人们能够定性或半定量的分析扩散连接因素对接头性能的影响。 |
