English translation for "扩散研究"
|
- dispersal studies
Related Translations:
扩散传输: diffuse transmission 扩散渗析: diffusion dialysisdiffusive dialysis 扩散热处理: diffusing heat treatment 扩散效应: diffusing effectdiffusion effectdiffusional effectspread effectspreading effect
- Example Sentences:
| 1. | Diffusion of copper in type 316 stainless steel
铜在不锈钢中的扩散研究 | | 2. | Research on network - based knowledge diffusion of industrial cluster
基于知识网络的产业集群知识扩散研究 | | 3. | Diffusion field of technological innovation a new method of research on spatial diffusion of technological innovation
技术创新空间扩散研究的一种新方法 | | 4. | A website packed with data , much of it provided by the center for nonproliferation studies at the monterey institute of international studies
一个有著许多资料的网站，多数资料由蒙特利国际研究学院的防止核武扩散研究中心提供。 | | 5. | On the achievement foundation in the domestic and foreign technological innovation diffusion research , this thesis elaborates representative personage ' s typical viewpoint , points out the characteristic and limitation of some ; afterwards it construes some concepts of technical innovation diffusion
本文在国内外技术创新扩散研究的已有成果基础上,阐述代表人物的典型观点,指出其中一些观点的特点和局限性;随后界定了关于技术创新扩散的一些概念。 | | 6. | Because of these insufficiency , this paper described the mechanism and discipline of technology diffusion and empirical analysis about it based on the study of the basic conception , model and mechanism and three perfect mathematic models such as bass model , logistic model and steffens - murthy model . this paper set up four economic mathematic models as follows
本文在充分分析技术创新扩散的基本概念、基本模式、基本机制以及借鉴技术创新扩散研究中相当成熟的三个模型： bass模型、 logistic模型和steffens - murthy模型的基础上，进一步从定量分析的角度对技术创新扩散的机理和规律进行了探讨，并进行了相关的实证分析。 | | 7. | In the second part , the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials , die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components . in the last chapter , the design tool for advanced electronic package was studied . the main conclusions in the second part are as follows
论文第二部分电子封装可靠性研究包含对塑封材料中水汽扩散研究、填充不流动胶的倒装焊芯片可靠性研究以及大功率器件散热问题研究三方面内容，最后为实现封装设计标准化和自动化，研究了若干最主要的电子封装构型的参数化有限元建模、加载和相应的求解方法。 |
- Similar Words：
- "扩散压" English translation, "扩散压合" English translation, "扩散压亏" English translation, "扩散压力" English translation, "扩散蚜" English translation, "扩散掩蔽" English translation, "扩散掩蔽法" English translation, "扩散掩模" English translation, "扩散掩模窗口" English translation, "扩散衍射" English translation
|
|
|
