English translation for "底加工"

stockfitting

Example Sentences:

	1.	In microelectronic process , a large amount of stress which deteriorates performance of product is led in processes of slicing , lapping , edging , epi , diffusion , oxidizing , preparation of electrode and multilevel metallization , especially , process of wafer substrate 在微电子工艺中，硅棒的拉制、切片、磨片、倒角、外延、扩散、氧化、电极制备、多层布线及划片等工艺中都会产生大量严重影响产品性能的应力，其中尤其在衬底加工工艺中最为严重。
	2.	Bottom - up processing and feature detecting theory based on strong electrophysiological evidences has played a dominant role in the visual research for long time . people know top - down processing just by common sense . knowledge or experience are recalled from memory by reactivation of their neural representations and affected visual processes . however recently , researches from human and monkey provide experimental evidences for top - down processing . first , mnemonic representation of visual objects and faces , located in the ventral processing stream of visual perception in monkey , provide the best evidences of how neuronal codes are created by neurons that have the special ability to link the representations of temporally associated stimuli ; second , experiments suggest that not only bottom - up signals from the retina but also top - down signals from the prefrontal cortex can trigger the retrieval of associative codes , which may serve as a neural basis both for the conscious recall and for the visual processes affected by top - down processing further studies will improve people s understanding of the causal relation of activation and behavior by use of combined fmri and electrophysiology or lesion studies 联想性编码是通过学习由一些具有特殊功能的神经元建立的，这些神经元具有将时间性关联刺激的表征联系起来的能力。其次，不仅来自视网膜的底-顶信号，而且来自前额叶的顶底信号都能触发联想性编码的提取，既可以作为有意识回忆的神经基础，又是顶-底加工影响视觉过程的基础。脑损伤病人研究具有高时间分辨率的人类功能性核磁共振成像functional magnetic resonance imaging , fmri和猴fmri研究以及猴细胞电生理分析相结合,将进一步加强人们对视觉脑机制的全面理解。
	3.	Slicing , lapping , and edging all can lead to intensive stress and damage in wafer process because of too intensive and unbalanced mechanical action to wafer substrate , at last cumulating stress come into being . at present damage and stress has become the most important matter which affects quality and finished product ratio of wafer 在衬底加工过程中，切片、磨片、倒角等工序都会对硅片造成大的损伤和应力，这些都是因为在加工过程中机械作用过于强烈，而且不能均衡的作用在加工的硅片上，最终造成大的应力累积。

Similar Words：

"底级发动机" English translation, "底级箱" English translation, "底级医疗宝石" English translation, "底脊" English translation, "底剂" English translation, "底加料注塑机" English translation, "底加作用" English translation, "底甲板" English translation, "底价" English translation, "底价，最低价" English translation