| 1. | Prevailing torque type all - metal hexagon nuts with flange with metric fine pitch thread
带公制小螺距螺纹法兰的流行全金属扭矩型六角螺母 |
| 2. | Aircraft bolts and nuts . bolt , bihexagonal head , with locking hole . iso m thread . 4g class . fine pitch
航空用螺检螺母.带锁紧孔十二角头螺栓. iso m螺纹. 4g级.小螺距 |
| 3. | Stud ends , ports , for fittings , valves - part 1 : plug screw with metric fine pitch thread ; general outlay of types
配件和阀门用螺柱端和孔.第1部分:带公制小螺距螺纹螺 |
| 4. | Prevailing torque type all hexagon nuts with flange , with metric fine pitch thread iso 12126 : 1997 , modified ; german version en 1667 : 1997
米制小螺距螺纹的带法兰的经常作用的扭矩型全六角头 |
| 5. | Ground thread taps for iso metric threads of tolerances 4h to 8h and 4g to 6g coarse and fine pitches . manufacturing tolerances on the threaded portion
公差为至和至大小螺距的米制螺纹的磨齿丝锥.螺纹部分的制造公差 |
| 6. | Prevailing torque type hexagon nuts with non - metallic insert , style 1 , with metric fine pitch thread - property classes 6 , 8 and 10 iso 10512 : 1997 ; german version en iso 10512 : 1997
公制小螺距螺纹的1型经常作用的扭矩型六角头螺母六角 |
| 7. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array
半导体器件机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小螺距球栅阵列的设计指南 |
| 8. | Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array
半导体器件的机械标准化.第6 - 5部分:表面安装半导体器件外壳外形图绘制的一般规则.小螺距刃片栅格排列的设计指南 |
| 9. | Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine pitch land grid array
半导体器件的机械标准化.第6 - 6部分:平面式安装半导体器件外壳外形图绘制的一般规则.小螺距刃片栅格排列的设计指南 |
| 10. | Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array
半导体器件的机械标准化.第6 - 6部分:半导体器件包装用表面安装略图制备的一般规则.小螺距刃片栅格排列的设计指南 |
