English translation for "多芯片组件"
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- mcm multil chicarrier
Related Translations:
芯片处理: chiprocessingdie processingwafer processing 芯片数量: chicountcount, chip 芯片操作系统: cos chioperation system
- Example Sentences:
| 1. | In this paper the applications of diamond material to mcm to improve thermal characteristics and thermal stress problem are studied
本文研究了金刚石材料在多芯片组件中热特性改善和热应力问题。 | | 2. | Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material
本文对金刚石材料在多芯片组件热性能改善和热应力研究,对金刚石在多芯片组件封装热设计应用具有一定的参考价值和提供一定的理论依据。 | | 3. | Firstly , background of the project was introduced , including characters of multi - chip module , electronic design automation and our destination
首先介绍了该课题的背景，包括多芯片组件的发展与特点，现代电子设计自动化的相关进展，以及我们的工作目标。 | | 4. | In this paper outlining the characteristics of diamond substrate and problems to be faced with , and measures to be taken , introducing knowledge of multi - chips modules packaging
本文首先综述了热沉用金刚石基板的特点和面临的问题及相应的措施;并介绍了多芯片组件封装技术相关知识。 | | 5. | Coverage ranges from thermal properties and semiconductor materials to mosfets , digital logic families , memory devices , microprocessors , digital - to - analog and analog - to - digital converters , digital filters , and multichip module technology
覆盖范围从热性能和半导体材料的mosfet ，数字逻辑家庭，记忆体装置，微处理器，数位类比和模拟到数字转换器，数字滤波器，以及多芯片组件技术。 | | 6. | Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of compact packaging and high density
多芯片组件( mcm )是微电子封装的高级形式，它是把裸芯片与微型元件组装在同一个高密度布线基板上，组成能够完成一定的功能的模块甚至子系统。 | | 7. | With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed . multi - chip module ( mcm ) packaging technologies rapidly develop because of it ’ s characteristic of improving frequency and increasing transmission speed and so on
多芯片组件( multi - chipmodule即mcm )封装技术因组装密度高,改善了频率特性和传输速度等一系列优点获得了迅速发展。 | | 8. | Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built , thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built , and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
本文根据实际的多芯片组件的封装结构,建立了三维温度场分析模型,分析了金刚石作为导热层和基板对多芯片组件散热性能的改善;建立了二维和三维的芯片-粘结层-基板热力学模型,分析了不同的基板/芯片厚度比和面积比对层间热应力分布的影响。 |
- Similar Words：
- "多芯片模块" English translation, "多芯片模组" English translation, "多芯片微电路" English translation, "多芯片系统" English translation, "多芯片芯片模块" English translation, "多芯片组件, 多芯片模块" English translation, "多芯软电线" English translation, "多芯软线" English translation, "多芯线" English translation, "多芯线电缆" English translation
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