English translation for "后端设计"

back and design

Example Sentences:

	1.	Back and design 后端设计
	2.	Route : the final step of the whole design , each cell in design is connected by net 6 .绕线阶段是芯片后端设计的最后一个阶段,完成单元之间的连线。
	3.	This paper presents the physical implementation process of the digital asic for the wireless endoscope by eda tools 文中给出了利用后端设计的eda工具对无线内窥镜系统胶囊内数字集成电路进行物理实现的过程。
	4.	In the paper , we will focus on the digital module backend design , which is one of important application fields of ic 本文详细介绍了,数字机顶盒芯片的数字模块后端设计工作,从得到门级网表到交出gdsii研究开发的全过程。
	5.	The thesis proposed a new back - end design method , which is a design flow combines physical compiler and silicon ensemble effectively 文中提出了一种后端设计的新方法，即physicalcompiler综合和siliconensemble布局布线有效结合的设计流程。
	6.	In this article , i introduced a layout design flow of coprocessor that is compatible with the intel m80c287 according to the full - custom ic backend design methodology 本论文按照全定制ic的后端设计流程，即基本单元版图库建立、版图布局设计、布线设计以及版图设计验证和后仿真。
	7.	The transistor count is 3 . 8 million ; the package is surface mount 240 - pin quad flat pack ( qfp240 ) ; and the die size is 98mm2 ; the most advanced research progress on microprocessor architecture is extensively studied to get technical preparations for microprocessor design 该处理器目前正在进行后端设计，即将采用0 . 25 mcmos工艺流片，整个处理器的晶体管数目为380万，封装形式是qfp240 ， die面积为98mm ~ 2 。
	8.	Adopts vdsm process technology however two outstanding problems are faced to ic layout design when the feature size reaches to 0 . 18 m or lower : 1 . timing convergence problem seriously affects the circuits schedule , and the interconnect - delay has exceeded more than 70 % of the total circuits ’ delay . 2 . si problem , usually it consists two aspects of ir - drop and crosstalk . these problems often affect the chip function after tapout 本篇论文就是针对超深亚微米阶段soc芯片后端设计所面临的挑战,提出了运用连续收敛的布局布线策略,尤其是虚拟原型的设计理论,来快速验证布局,进而提高布线的成功率,并且提出了一种改进的布局评估模型,提高对soc芯片预测布线的准确度;同时,对于时钟驱动元件选择,文中提出了一种基于正态分布模型来达到更有效的选取。
	9.	The paper is composed by three parts ; we ' ll introduce the background of ic design in the first part , which also covers the developing in domestic and foreign industry ; the whole flow of digital ic backend design will be presented detailed in the second part ; the last part will summarize the paper , as well as discuss the future work 这篇论文主要包括如下三个部分:第一部分为绪论,主要关于国内外行业相关背景,以及课题背景;第二部分为数字后端设计开发过程,分为设计的初始化,时序设置,芯片布局,标准单元摆放,时钟树综合,绕线,物理验证。
	10.	The design flow includes the construction of basic cell libraries , placing & routing , layout verification and post - layout simulation , etc . moreover , the layout design of basic cells and functional modules , the measures of circuit protection and methods to reduce the parasitic effect are also been discussed 这个流程介绍了与intelm80c287协处理器完全兼容的协处理器的后端设计过程。介绍了协处理器设计过程中基本单元和一些主要功能模块的设计，以及设计中的保护措施和减少寄生效应的设计方法。

Similar Words：

"后端面" English translation, "后端碰撞" English translation, "后端平台" English translation, "后端墙" English translation, "后端全悬挂的" English translation, "后端示廓灯" English translation, "后端收费" English translation, "后端数据库" English translation, "后端数据库处理机" English translation, "后端数据库系统" English translation