| 1. | Specification for solderability tester by globule method
焊球法可焊性测试仪.技术条件 |
| 2. | Solderability tests for surface mounted devices
表面组装元器件可焊性试验 |
| 3. | Specification for solderability tester by solder bath method
焊槽法可焊性测试仪.技术条件 |
| 4. | Test method of solderability for printed boards
印制板可焊性测试方法 |
| 5. | Specification for solderability tester by wetting balance method
润湿秤量法可焊性测试仪.技术条件 |
| 6. | Printed wiring boards , solderability of
印制电路板的可焊性 |
| 7. | Review and prospect of solderable tin - based binary alloy plating
可焊性锡基二元合金镀层研究的现状与展望 |
| 8. | Steel for the reinforcement of concrete - weldable reinforcing steel - general
混凝土加筋用钢.可焊性钢筋.总则 |
| 9. | Test methods for bare wires - solderability test of coating - solder globule method
裸电线试验方法镀层可焊性试验焊球法 |
| 10. | Excellent in solderability and high heat resistance with either flow or reflow soklering
可焊性和耐焊性优，适用于流焊和再流焊。 |
