Pin - through - hole reflow soldering technology 穿孔再流焊技术
2.
Excellent in solderability and high heat resistance with either flow or reflow soklering 可焊性和耐焊性优，适用于流焊和再流焊。
3.
Delamination caused by electrical - over - stress ( eos ) and moisture expansion during reflow soldering have shown different delamination patterns 由过电应力( eos )和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式。
