English translation for "丝球"

skein
spireme

Example Sentences:

	1.	Specifications for fully automatic gold wire ball bonder 全自动金丝球焊接机技术条件
	2.	Brass male female ball valve 黄铜内外丝球阀
	3.	As a contrast object , gold wire ball bonding technology was also studied 金丝球键合作为对比研究对象引入本文研究范围。
	4.	Trough the experiment , we probed to the suited mount method ( mount with 183 soldering paste ) and bonding technique ( ball bonding with the gold silks of 18 m in diameter ) 通过实验，探索出了合适的贴装方式( 183焊膏贴装)和管芯键合工艺(直径18 m的金丝球焊) 。
	5.	Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components 铜丝球键合是一种有望取代现行金丝球键合工艺的新技术,这一技术对于降低微电子元器件的成本、提高元器件的可靠性具有重要意义。
	6.	The whole process of copper wire ball bonding and gold wire ball bonding were compared and analyzed , and a central composite design of experiment ( doe ) approach was applied to optimize the parameters of free air ball formation process and bonding process , separately 本文首先对比分析了铜丝球键合和金丝球键合的全过程,采用实验设计分别对烧球工艺参数和键合工艺参数进行了优化。在此优化参数下,获得了连接良好的铜丝球键合点和金丝球键合点。
	7.	A reliability experiment of thermal aging was carried out for the two types of joints , scanning electron microscopy , energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints , and kinetics model of imc formation was established . the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature , imc growth is more sensitive to the aging temperature than the aging time , the activation energy of cu - al imc growth is 97 . 1kj / mol and the major forming cu - al imc are cual2 and cu9al4 , the activation energy of au - al imc growth is 40 . 1kj / mol and the main au - al imc are au4al and au5al2 , with au2al and aual at the interfacial periphery of joints , the rate of cu - al imc growth is about 1000 times slower than that of au - al imc , and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours 研究结果表明:金属间化合物厚度与老化时间的关系符合抛物线法则,金属间化合物的生长对老化温度比老化时间更加敏感; cu - al金属间化合物生长的激活能为97 . 1kj / mol ,老化后金属间化合物呈层状分布,主要相为cual2和cu9al4 ; au - al金属间化合物生长的激活能为40 . 1kj / mol ,主要相为au4al和au5al2 ,同时在界面周边区域生成了au2al和aual ;老化过程中cu - al金属间化合物生长速率比au - al金属间化合物生长速率小103数量级;金丝球键合点200老化96小时出现了明显的kirkendall空洞和裂纹,但铜丝球键合点200老化2900小时和250老化169小时都没有形成空洞和裂纹。

Similar Words：

"丝屏罩" English translation, "丝普林斯" English translation, "丝强斯" English translation, "丝鞘" English translation, "丝切砖" English translation, "丝球带, 小球带" English translation, "丝球菌" English translation, "丝球期" English translation, "丝球肾炎" English translation, "丝球体" English translation