| 1. | Simulation of thermal performance of ulsi interconnect system
互连系统热特性的模拟 |
| 2. | Development of diffusion barrier for cu interconnection in ulsi
互连扩散阻挡层的研究进展 |
| 3. | Vdsm ulsi place and route optimization research
布局布线优化设计研究 |
| 4. | Chemical mechanical polishing for mutilevel interconnect in ulsi
多层互连中的化学机械抛光工艺 |
| 5. | Copper electrodeposition in ulsi
超大规模集成电路中的电沉积铜 |
| 6. | State - of - the - art of the on - chip copper interconnect technology for ulsi ' s
集成电路片内铜互连技术的发展 |
| 7. | The main purpose of the article is to study the reliability of copper interconnection
本论文研究了ulsi中铜互连的可靠性问题。 |
| 8. | Influence of interconnection configuration on thermal dissipation of ulsi interconnect systems
超大规模集成电路互连系统的布线构造对散热的影响 |
| 9. | Theoretical calculation on the mechanical characterization of ulsi two - layer interconnect films by surface acoustic waves
互连布线双层薄膜机械特性的理论计算 |
| 10. | Nowadays , coms technology has been extensively applied for ulsi ( ultra - large - scale integrated ) circuits industry
现代超大规模集成电路( ulsi )制造过程的主流工艺为coms工艺。 |
