| 1. | Study on characteristic of electric transfer of so2 in corona discharge electric field
2在放电电场中的电迁移特性研究 |
| 2. | Mobility of ions
离子的电迁移率 |
| 3. | Atoms in the solder joints move as a result of both diffusion and electromigration
另一方面，扩散和电迁移效应，则造成焊点中的原子移动。 |
| 4. | As an electric current passes through , the joule heating and electromigration effects occur in the flip chip solder bumps
当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。 |
| 5. | There are many aspects of power grid integrity analysis , for example , analysis of ir drop and analysis of electromigration
电源网格的完整性分析包含很多方面，如irdrop分析，金属电迁移等。 |
| 6. | Standard test method for estimating electromigration median time - to - failure and sigma of integrated circuit metallizations metric
集成电路金属喷镀总量和电迁移中值失效时间的评定标准试验方法 |
| 7. | Standard guide for design of flat , straight - line test structures for detecting metallization open - circuit or resistance - increase failure due to electromigration metric
检测由电迁移造成的喷镀金属开路或阻力增加失效率用的平板直线试验结构设计的标准指南 |
| 8. | Based on the theoretical studies , a band - pass filter circuit is optimized in order to decrease current density and increase the electromigration lifetime
在理论研究基础之上，借助于计算机辅助设计，针对一个带通滤波器电路进行了电路优化，以提高其电迁移寿命。 |
| 9. | About the techniques of the reliability design , a common method for 1c reliability design is introduced and the failure principles of electronmigration are studie d
在可靠性设计方面，介绍了集成电路可靠性设计的一般方法。影响铝互连的电迁移失效的各种因素中，电流密度是主导因素。 |
| 10. | Consequently , the metal interconnects of vlsi have smaller sectional area and carry increasing power density , which made the electromigration become one of the main latent damage modes
作为vlsi互连线的金属薄膜的截面积越来越小，其承受的功率密度急剧增加，使得电迁移成为电路的主要失效模式之一。 |
