| 1. | Requirement for soldering technology of pcb assembles
印制电路组件装焊工艺要求 |
| 2. | General specification for soldering connection of tube
导管钎焊连接件通用规范 |
| 3. | Nipples for cables for controls ; nipples for soldering
控制装置用缆索的管接头.钎焊管接头 |
| 4. | Requirements for soldered electrical and electronic assemblies
软钎焊电气和电子组件的要求 |
| 5. | Requirements for soldered electrical and electronic assemblies
焊接的电气和电子组件的要求 |
| 6. | Workmanship requirements for soldered electronic assemblies - general
钎焊电子组件的工艺要求.总则 |
| 7. | Standard specification for solder metal
焊料金属的标准规范 |
| 8. | Screen printing technology for solder ball flip chip for smt
倒装芯片及晶圆和基底凸起的网版印刷技术一 |
| 9. | Testing methods for soldering fluxes
钎焊熔剂的试验方法 |
| 10. | Liquid flux for soldering rosin base
锡焊用液态焊剂 |
