| 1. | Trend of alloying investigation for gold bonding wires
键合金丝的合金化研究动向 |
| 2. | Air coil winding machine for self bonding wire
自融线空心线圈绕线机 |
| 3. | Torque requirements for bond wire penetration of bonding set screw
连接止动螺钉的连接导线穿过的扭矩要求 |
| 4. | Standard practice for visual inspection of semiconductor lead - bonding wire
半导体引线连接线的外观检查用标准实施规范 |
| 5. | Bond wire modeling standard
焊线模拟标准 |
| 6. | Standard practice for inspection of surface quality of semiconductor lead - bonding wire
半导体器件键合丝表面质量检验方法 |
| 7. | Iso 9001 quality system . hope to be major supplier of cob and gold bonding wire in semiconductor packaging industry
全部制程环境为标准半导体无尘超净空间， iso 9001质量体系保证。 |
| 8. | Cast metal joint boxes for power cables up to 10 kv ; correlation of joint boxes with paper - insulated cables ; correlation of bare stranded copper bonding wire
最高可达10 kv电力电缆用金属铸造连接盒.第3部分 |
| 9. | It is not possible to join the two pins within the ic package because the analog part of the converter cannot tolerate the voltage resulting from the digital current flowing in the bond wire to the chip
（过去）无法在芯片内部将二者连接的原因是数字电流流经内部引线电阻产生过大的电压，芯片的模拟部分无法承受。 |
| 10. | Special for cob bonding wire al si fine wire fine gold lead bonding wire and electronics manufacturing service , have been evaluated vendor for motorola . imported equipment and material from usa , uk , germany and japan . advanced process under clean room environment
主要开发和生产cob邦定铝线led键合金线高纯铝线fine bonding wire ，同时提供电子产品委托生产服务ems ，是motorola公司的正式供货商。 |
