阵列尺寸 meaning in Chinese

array dimensions

At present , bga / csp is becoming the mainstream of the advanced ic package technology
目前微电子球栅阵列尺寸封装( bga csp )正成为高端ic封装的主流技术。
It significantly outperforms an array of spatially displaced pressure hydrophones of comparable array - manifold size and computational load but may involve more complex hardware
与声压传感器组成的阵列相比，相当的阵列尺寸和计算负载的条件下，大大提高了估计性能。
The large size not only makes the radar easy to be detected , but also increases engineering costs for the ‘ golden seashore ’ it occupied . furthermore , large size brings serious troubles in the antenna setting - field choosing , installation and maintenance . distributed array is one of the solution way
过大的阵列尺寸不仅易于暴露阵地目标,还因占用“黄金海岸”提高了工程造价,同时也给雷达阵地的选择以及雷达系统的管理、维护带来许多不便,分布式阵列是解决途径之一。